June/July 2015 Digital Edition
Digital Version of May/June 2015
10-week summer ‘STEM’ internships are available at national labs and other sites
Interns at Argonne
DHS is publicizing its 2012 summer internship programs in science, technology, engineering and math (frequently referred to as STEM), which offer 10-week programs at more than 15 different federal labs and research installations, and will pay stipends of $5,000 to undergraduates and $7,000 to graduates.
The areas of interest for these internships for undergraduates include engineering, computer science, mathematics, physics, chemistry, biological/life sciences, environmental science, emergency and incident management, social sciences. For graduates, the areas of interest include nuclear engineering, physics, mathematics, statistics, computer sciences, systems engineering, electrical engineering and material science.
The national labs at which these internships can take place include Argonne, Idaho, Lawrence Berkeley, Lawrence Livermore, Los Alamos, Oak Ridge, Pacific Northwest, Sandia, Savannah River, while the research facilities that also play host to some internships include the Homeland Security Studies and Analysis Institute, National Institute of Standards and Technology, Coast Guard Research and Development Center, Plum Island and others.
U.S. citizenship is required to land one of these internships, says DHS, and the application deadline is January 15, 2013.
“The DHS HS-STEM Summer Internship Program provides students with the opportunity to conduct research at federal research facilities located across the country,” says DHS on its Website. “The goal of this program is to engage a diverse, educated, and skilled pool of scientists and engineers in HS-STEM issues and to promote long-term relationships between student researchers, DHS, and federal research facilities to enhance the HS-STEM workforce. DHS has partnered with the Oak Ridge Institute for Science and Education (ORISE) to manage the application and review process, notification, and implementation of the program.
Further information is available by clicking here.